Process for the manufacture of printed circuits

Details Process for the manufacture of printed circuits Process for the manufacture of printed circuits

H - Electricity

05

K

356/12

H05K 3/10 (2006.01) B05D 5/12 (2006.01) C23F 1/02 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01) H05K 3/42 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1152225

ABSTRACT OF THE DISCLOSURE The present invention provides a process for the production of a printed circuit from a copper laminated substrate which has been bored to provide boreholes, cleaned, activated, when required, reduced and aftertreated wherein a conducting interconnection pattern is applied to the substrate providing solder eyes at said boreholes the improvement in which. a layer of nickel, cobalt or nickel/cobalt is applied to said boreholes and solder eyes by treating the substrate covered in areas not to be coated with said layer with a resist with a chemical nickel, cobalt or nickel/cobalt bath and subsequently removing any resist or salt substate.

352367

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