Process for the manufacture of substrates to interconnect...

Details Process for the manufacture of substrates to interconnect... Process for the manufacture of substrates to interconnect...

H - Electricity

05

K

356/16

H05K 7/06 (2006.01) H05K 1/11 (2006.01) H05K 3/46 (2006.01) H05K 3/10 (2006.01)

Patent

CA 1277429

ABSTRACT An improved process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby. Interconnection boards having multiple layers of circuit patterns, boards which can communicate from side to side and boards having improved dimensional stability can be made according to the process of this invention.

517685

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