H - Electricity – 05 – F
Patent
H - Electricity
05
F
317/3
H05F 3/00 (2006.01) H05K 9/00 (2006.01)
Patent
CA 2013682
ABSTRACT OF THE DISCLOSURE A method and apparatus for grounding multi-layer insulations (MLI) by electric contact, of either of each layer with the other or of all the layers with the underlying structure by means of one or more points of attachment of mechanical type. This makes it possible to simplify the construction procedure and increase the reliability. This method is essentially carried out in the following manner: The layers (Fig. 1) which form the multi-layer insulations (6), (7), (8) are metalized on both faces and have holes (9) which are also metalized. All layers are contacted with each other and with a part of the attachment system (3) which is also electrically conductive. The other part of the attachment system (2) is positioned on the structure (1) in such a manner as to permit the passage of electric charges. By contacting the two parts of the attachment system (2) (3), the multi-layer insulation is grounded with the structure. The invention lies within the technical field of passive thermal protections, especially for space structures (space apparatus and systems etc.). The object of the invention is to permit the removal of electric charges on multi-layer insulations.
Marzi Danilo
Stonier Roger A.
Marzi Danilo
Selenia Spazio S.p.a.
Sim & Mcburney
Stonier Roger A.
LandOfFree
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