Process for the preparation of articles with a...

C - Chemistry – Metallurgy – 09 – D

Patent

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Details

C09D 163/10 (2006.01) B41M 3/06 (2006.01) B41M 7/00 (2006.01) B44C 3/02 (2006.01) B44C 5/02 (2006.01) B44F 9/02 (2006.01) C09D 7/12 (2006.01) C09D 167/06 (2006.01) C09D 167/07 (2006.01) C09D 171/00 (2006.01) C09D 171/02 (2006.01)

Patent

CA 2185245

The invention relates to a process for the preparation of articles with a three-dimensional surface structure, in which a substrate is printed, at least one of the printing inks employed for the printing being varnish-repellent, and the printed substrate is then varnished. In accordance with the invention, the printed substrate is varnished with a radiation-curable varnish which contains no amino resin and comprises A) from 18 to 99.9% by weight of an epoxy acrylate, a polyether acrylate or a polyester acrylate, B) from 0.1 to 5.0% by weight of a Bronsted acid or an acid anhydride, C) from 0 to 12% by weight of a photoinitiator, D) from 0 to 40 % by weight of water or at least one organic solvent, E) from 0 to 10% by weight of a polyol which may be ethoxylated and/or propoxylated and has from 2 to 50 carbon atoms in the molecule, and F) from 0 to 30% by weight of other auxiliaries and additives, and the varnish coat applied is cured with high-energy radiation.

Selon un procédé de production d'objets à structure superficielle tridimensionnelle, on réalise une impression sur un substrat, au moins une des encres d'impression utilisées repoussant les laques, puis on recouvre le substrat imprimé d'une laque durcissable par exposition à des rayonnements. Cette laque ne contient pas d'aminoplaste et contient (A) 18 à 99,9 % en poids d'un acrylate époxy, d'un acrylate de polyéther ou d'un acrylate de polyester; (B) 0,1 à 5,0 % en poids d'un acide de Brönsted ou d'un anhydride d'acide; (C) 0 à 12 % en poids d'un photo-initiateur; (D) 0 à 40 % en poids d'eau ou d'au moins un solvant organique; (E) 0 à 10 % en poids d'un polyol, le cas échéant éthoxylé et/ou propoxylé, ayant 2 à 50 atomes de C dans la molécule; et (F) 0 à 30 % en poids d'autres auxiliaires et additifs. La couche de laque appliquée sur le substrat est ensuite durcie par exposition à des rayonnements de haute énergie.

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