Process for the preparation of diamond

Details Process for the preparation of diamond Process for the preparation of diamond

C - Chemistry, Metallurgy

23

C

C23C 16/26 (2006.01) C01B 31/06 (2006.01) C23C 16/01 (2006.01) C23C 16/02 (2006.01) C23C 16/27 (2006.01) C30B 25/00 (2006.01) C30B 29/04 (2006.01)

Patent

CA 2043447

ABSTRACT OF THE DISCLOSURE An interrupting layer is formed on the surface of a substrate with inorganic fine powders and a surface of the interrupting layer is contacted with gases obtained by exciting raw material gases containing carbon sources gases, followed by the separation of the diamond synthesized from the substrate. The use of the interrupting layer composed of the inorganic fine powders allows ready separation of the diamond from the substrate and the diamond separated is suitable for diaphragms for speakers, heat conductive plates, cutting tools, semiconductors, etc. by appropriately choosing shapes of the substrate. Further, the resulting diamond film is pulverized, thereby yielding diamond powders which are useful for abrasive tools, cutting tools, etc.

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