Process for the preparation of laminates

Details Process for the preparation of laminates Process for the preparation of laminates

B - Operations, Transporting

32

B

154/103

B32B 27/04 (2006.01) B32B 27/38 (2006.01) C08G 59/68 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1308641

Process for the preparation of laminates Abstract A process is described for the preparation of a laminate comprising thesteps i) preparation of a layer by bringing into contact a fibrous substrate with a curable mixture containing an epoxy resin having on average at least two 1,2-epoxide groups per molecule or a mixture of these epoxy resins and a compound of the formula I Image (I) or a mixture of these compounds, in which a and b are independent of one another 1 or 2, R1 is a .pi.-arene, R2 is a .pi.-arene or an indenyl- or cyclopentadienyl anion, X- is an anion [LQm]- or an anion of a partly fluorinated or perflourinated aliphatic or aromatic sulfonic acid, L is P, As or Sb, Q is fluorine or some of the Q substituents may also be hydroxyl groups, and m corresponds to a value which exceeds the valence of L by unity, ii) preparation of a laminated sequence from at least two layered materials which are to be bonded together, at least one of which is a layer which is obtainable according to step i), in which the curable mat- erial is essentially present in its unaltered state, and iii) compression moulding of the said laminate sequence at elevated temp- erature, in which pressure and temperature are selected in such a way that a liquid resin matrix is present at the beginning of this step, in which an initial fall in the viscosity is produced, so that entrained gases can virtually entirely escape from the laminate sequence, and that in the subsequent crosslinking reaction the rise in viscosity is carried out so quickly that the resin which flows out does not bind the compression mould. The laminates obtainable according to the invention are suitable for the preparation of printed circuit boards and insulation materials.

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