Process for the preparation of phenolic resin- containing...

C - Chemistry – Metallurgy – 08 – L

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400/1310, 400/40

C08L 61/04 (2006.01) C08G 8/38 (2006.01) C08L 101/00 (2006.01) C09J 161/14 (2006.01)

Patent

CA 1177183

ABSTRACT OF THE DISCLOSURE Aqueous dispersions of a phenolic resole and a thermoplastics polymeric material or a rubber, suitable for use as adhesives, are prepared by a) dissolving a solid thermoplastics polymeric material, such as a polyvinyl acetal or a nylon polyamide, or rubber in a phenol, b) adding a nonionic or anionic surface active agent and/or protective colloid, c) adjusting the mixture to a pH above 7 by addition of a base, d) adding aqueous formaldehyde solution, or a formaldehyde donor, to a molar ratio of phenol to formaldehyde within the range 1:1 to 1:3, e) if necessary, adding water, and f) heating the mixture to form a phenolic resole.

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