Process for the production of a solder-rejecting protection...

Details Process for the production of a solder-rejecting protection... Process for the production of a solder-rejecting protection...

H - Electricity

05

K

117/101

H05K 3/12 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1041848

A B S T R A C T A process for producing a solder-rejecting protection on circuit boards including applying a viscous auxiliary lacquer to the top of a circuit board, pressing the auxiliary lacquer through apertures in the circuit board to cover solder edges on the solder side of the circuit board, apply- ing a solder-rejecting substance to the solder side to cover conductor paths, and removing the auxiliary lacquer by a solvent to leave the solder edges free for the application of a solder.

217327

Affiliated with

Also associated with

Rating

Process for the production of a solder-rejecting protection... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the production of a solder-rejecting protection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the production of a solder-rejecting protection... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-228531