Process for the production of printed circuits with solder...

Details Process for the production of printed circuits with solder... Process for the production of printed circuits with solder...

H - Electricity

05

K

356/12

H05K 3/22 (2006.01) H05K 3/06 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1051559

ABSTRACT OF THE DISCLOSURE A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, character- ized by galvanically applying a sub-zones etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub zones with a solder rejecting property with the aid of passivation without impairing the solderbility of the etch-resistant metal layers of the first sub zones.

261258

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