C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
42/15
C08J 9/32 (2006.01) B01J 13/12 (2006.01) B41M 5/165 (2006.01)
Patent
CA 1095717
PROCESS FOR THE PRODUCTION OF RADIATION CURABLE COATING COMPOSITIONS CONTAINING MICROCAPSULES Yu-Sun Lee and Dale R. Shackle Abstract of the Disclosure A process is provided for producing a radiation curable coating composition containing microcapsules comprising the steps of preparing a dispersion of substantially discrete microcapsules in a continuous phase, the continuous phase comprising a liquid volatile solvent, preparing a liquid radiation curable suspending medium, the liquid radiation curable suspending medium comprising one or more ethy- lenically unsaturated organic compounds having at least one terminal ethylenic group per molecules, mixing the dispersion of substantially discrete microcapsules in the continuous phase and the liquid radiation curable suspending medium with turbulent agitation to form an intimate mixture of the dispersion of microcapsules and the liquid radiation curable suspending medium, and applying heat and vacuum to the mixture, while maintaining the said agitation, until the liquid volatile solvent is substantially removed from the mixture to form a dispersion of substantially discrete microcapsules in the liquid radiation curable suspending medium, the heat being applied to maintain the mixture at a temperature above the boiling point of the volatile solvent at the vacuum level.
295479
Lee Yu-Sun
Shackle Dale R.
Ridout & Maybee Llp
The Mead Corporation
LandOfFree
Process for the production of radiation curable coating... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for the production of radiation curable coating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the production of radiation curable coating... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-109685