C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 5/09 (2006.01) C08F 8/30 (2006.01) C08G 59/40 (2006.01) C08G 59/50 (2006.01) C08G 73/16 (2006.01) C08K 5/3412 (2006.01) C08L 63/10 (2006.01) C08L 79/08 (2006.01) C08L 101/08 (2006.01)
Patent
CA 2243283
This invention relates to a process for making a thickened thermoset resin composition, comprising: mixing (A) a carboxylic acid containing thermoset resin composition; and (B) at least one compound represented by Formula (B-I) wherein: R1, R2, R3 and R4 are independently hydrogen or methyl; R5 is hydrogen, a hydrocarbon group or a substituted hydrocarbon group, the substituents on said substituted hydrocarbon group comprising oxygen and/or nitrogen; and n is at least 1.
L'invention porte sur un procédé d'épaississement de composition de résine thermodurcissable consistant à mélanger: (A) une composition de résine thermodurcissable contenant un acide carboxylique; et (B) au moins un composé de formule (B-I) dans laquelle R?1¿, R?2¿, R?3¿ et R?4¿ sont indépendamment H ou méthyle; R?5¿ est H, ou un groupe hydrocarbure ou hydrocarbure substitué dont les substituants sont oxygène et/ou azote; et n est au moins 1.
Gowling Lafleur Henderson Llp
Premix Inc.
LandOfFree
Process for thickening thermoset resin molding compound... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for thickening thermoset resin molding compound..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for thickening thermoset resin molding compound... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1853265