B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 15/08 (2006.01) B01J 19/08 (2006.01) B05D 3/14 (2006.01) B05D 5/10 (2006.01) B05D 7/02 (2006.01) B05D 7/24 (2006.01) C23C 14/02 (2006.01) C23C 14/20 (2006.01) C23C 14/24 (2006.01)
Patent
CA 2099852
Abstract of the Disclosure PROCESS FOR UTILIZING A METALLIC INTERLAYER TO ENHANCE ADHESION BETWEEN A METAL AND A POLYMERIC SUBSTRATE A process for enhancing adhesion between a metal and a polymeric substrate utilizing a metallic interlayer. In the process, a polymeric substrate is exposed to a plasma at the substrate surface. The pressure is then lowered, and a first metal is vaporized, thereby coating the substrate. While the first metal is vaporizing, a second metal is vaporized and codeposits upon the first metal coated substrate. After a predetermined time, the first metal vaporization is stopped, while the second metal continues to vaporize and deposit upon the substrate. 92-3-307
Gte Products Corporation
R. William Wray & Associates
LandOfFree
Process for utilizing a metallic interlayer to enhance... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for utilizing a metallic interlayer to enhance..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for utilizing a metallic interlayer to enhance... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1366449