Process for wave soldering components on a printed circuit...

Details Process for wave soldering components on a printed circuit... Process for wave soldering components on a printed circuit...

H - Electricity

05

K

H05K 3/34 (2006.01) B23K 1/08 (2006.01)

Patent

CA 2146594

Abstract of the Disclosure The present invention relates to a wave soldering process wherein an inert gas atmosphere is injected inside the wave soldering machine, said inert gas atmosphere having a temperature which might be controlled. Particu- larly, the atmosphere can be heated at the same or different temperatures before injection, for example in the preheating zones, in the machine. The atmosphere can also be cooled (or injected at ambient temperature) e.g. in the cooling zone. Various atmospheres can be used (similar or different from one zone to another). The thermal efficiency of the heat transfer between the atmosphere and the printed circuit boards is thus greatly enhanced, which means less solder defects, higher components density and decrease of energy consumption and inert gas flow rate.

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