B - Operations – Transporting – 28 – D
Patent
B - Operations, Transporting
28
D
51/145
B28D 1/06 (2006.01) B23D 61/18 (2006.01) B24D 18/00 (2006.01)
Patent
CA 1172453
ABSTRACT OF THE DISCLOSURE A narrow wire blade with abrasive particles plated within a longitudinally-extending, plated cutting portion that extends from only one side of a wire core and has parallel side walls spaced by a controlled width.
394614
Khattak Chandra P.
Schmid Frederick
Smith Maynard B.
Crystal Systems Inc.
Smart & Biggar
LandOfFree
Process of forming a plated wirepack with abrasive particles... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process of forming a plated wirepack with abrasive particles..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of forming a plated wirepack with abrasive particles... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1229230