H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/12 (2006.01) H01L 21/607 (2006.01) H01L 23/522 (2006.01) H05K 3/46 (2006.01) H05K 1/00 (2006.01) H05K 1/09 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2077720
The process of the present invention allows inter- connecting one conductive layer to another in a Multichip Module. The process uses bumps formed by wire bonding, or any other means of forming bumps of .002"-.004" height with comparable diameter. These bumps create an opening through dielectric insulating layers, thereby allowing one conductive layer to be electrically connected to the next conductive layer.
Johansen Scott W.
Mccoy Dirk D.
Ag Communication Systems Corporation
R. William Wray & Associates
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