C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 9/16 (2006.01) B29C 44/34 (2006.01) C08F 265/02 (2006.01) C08F 265/04 (2006.01) C08F 265/06 (2006.01)
Patent
CA 2670570
A process comprising heating an aqueous dispersion of first structured polymer particles at a temperature of at least about 155°C, optionally in the presence of a base and/or a swelling agent, to produce an aqueous dispersion of heat treated structured polymer particles.
L'invention concerne un procédé consistant notamment à chauffer une dispersion aqueuse de premières particules polymères structurées à une température d'au moins 155°C environ, en présence éventuelle d'une base et/ou d'un agent gonflant, pour préparer une dispersion aqueuse de particules polymères structurées traitées thermiquement.
Devon Michael J.
Drumright Ray E.
Galloway James G.
Keefe Melinda H.
Nicholson Dwayne J.
Dow Global Technologies Inc.
Omnova Solutions Inc.
Sim & Mcburney
LandOfFree
Process of heat treating structured polymer particles does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process of heat treating structured polymer particles, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of heat treating structured polymer particles will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1543276