Process of making a waferboard panel having improved...

Details Process of making a waferboard panel having improved... Process of making a waferboard panel having improved...

B - Operations, Transporting

32

B

154/97

B32B 21/02 (2006.01) B27N 3/08 (2006.01) B27N 5/00 (2006.01) B32B 21/13 (2006.01) B32B 31/20 (1990.01)

Patent

CA 1294522

"PROCESS FOR MAKING A WAFERBOARD PANEL HAVING IMPROVED DIMENSIONAL STABILITY AND THE PANEL MANUFACTURED THEREBY" ABSTRACT OF THE DISCLOSURE A single step pressing process is provided for improving the thickness swelling properties of a waferboard panel. More specifically, the process involves forming the panel by maintaining the mat comprising the wafers and binding agent in admixture therewith, between press platens which are maintained at a preselected temperature for at least a predetermined time.

594540

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