Process of manufacturing printed wiring boards and printed...

Details Process of manufacturing printed wiring boards and printed... Process of manufacturing printed wiring boards and printed...

H - Electricity

05

K

356/18

H05K 3/22 (2006.01)

Patent

CA 1198524

TITLE OF THE INVENTION PROCESS OF MANUFACTURING PRINTED WIRING BOARDS AND PRINTED WIRING BOARDS MANUFACTURED BY THE SAME ABSTRACT A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unneces- sary portion of said copper-clad laminate by etching; melting off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer; or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.

418135

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