H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/12 (2006.01) H01L 21/48 (2006.01) H05K 3/40 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2070308
A process of producing a multiple-layer glass- ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.
Hashimoto Kaoru
Kamehara Nobuo
Niwa Koichi
Suzuki Hitoshi
Yamagishi Wataru
Fujitsu Limited
Mcfadden Fincham
LandOfFree
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