Process of scribing a conductor on a circuit board boards...

H - Electricity – 05 – K

Patent

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356/12

H05K 7/06 (2006.01) H05K 3/10 (2006.01) H05K 13/06 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1250960

ABSTRACT This invention relates to the manufacture of wire- scribed interconnection circuit boards. More particularly, this invention relates to the use of pulsed laser energy for bonding and stripping conductors during the scribing process, the pulses of laser energy being timed such that a pulse is emitted for each incremental length of conductor being scribed.

514116

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