H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/22
H05K 3/34 (2006.01) B23K 1/08 (2006.01) B23K 3/06 (2006.01)
Patent
CA 1159156
Abstract of the disclosure An improved process of soldering printed circuit boards includes the steps of forming a first solder wave flowing in the direction of movement of the printed circuit board, and a second solder wave higher in height than the first solder wave and flowing in the direction counter to the direction of movement of the printed circuit board. The board is moved in an inclined direction so that its under- surface contacts the first and second solder waves successively. Apparatus embodying this process can provide efficient soldering with a minimum of soldering faults, even when small chip type components are mounted at high density on the printed circuit board.
385236
Inoue Takao
Matsuda Chuichi
Saeki Keiji
Kirby Eades Gale Baker
Matsushita Electric Industrial Co. Ltd.
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