Process of supplying moisture at small flow rate

Details Process of supplying moisture at small flow rate Process of supplying moisture at small flow rate

H - Electricity

01

L

H01L 21/306 (2006.01) C01B 5/00 (2006.01) F22B 1/00 (2006.01) H01L 21/316 (2006.01)

Patent

CA 2255370

A process of supplying moisture at small flow rates which permits control with high precision of the flow of moisture to a semiconductor manufacturing line from an apparatus for generation of moisture, characterized in that the flow of hydrogen to a moisture generating reactor is controlled by means of a flow controller in such a way that an amount of hydrogen as fed is gradually increased from the start and reaches a specific set level such that when a specific time has passed, a predetermined rate of moisture begins to be produced and supplied to the semiconductor manufacturing line. The moisture is generated in the apparatus for generation of moisture in which hydrogen and oxygen are fed into a reactor provided with a platinum coat on the wall in the interior space, enhanced in reactivity by the platinum catalytic action and caused to instantaneously react with each other at a temperature lower than the ignition point to produce a moisture without undergoing combustion at a high temperature. 29

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