Process of using an active solder alloy

Details Process of using an active solder alloy Process of using an active solder alloy

B - Operations, Transporting

23

K

B23K 1/00 (2006.01) B23K 1/06 (2006.01) B23K 1/19 (2006.01) B23K 1/20 (2006.01) B23K 3/06 (2006.01) B23K 35/26 (2006.01) B23K 35/28 (2006.01)

Patent

CA 2302490

A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined: placing an active, low-temperature solder material on at least one of the surfaces of the workpieces to be joined; mechanically activating the molten solder material, to break oxide films on the solder material, while the solder material contacts the surfaces of the workpieces to be joined: assembling the surfaces of the workpieces to be joined; and applying pressure to the surfaces of the workpieces to be joined both while the solder material is molten and as the solder material cools to a solid.

La présente invention concerne un procédé permettant d'assembler des pièces par une soudure active. Ledit procédé consiste à nettoyer les surfaces des pièces à assembler; chauffer les pièces à assembler; placer un matériau de soudure actif à basse température sur au moins une des surfaces des pièces à assembler; activer mécaniquement le matériau de soudure fondu afin de rompre les films d'oxyde protecteurs sur le matériau de soudure tandis qu'il est en contact avec les surfaces des pièces à assembler; unir les surfaces des pièces à assembler; et appliquer une pression sur les surfaces des pièces à assembler alors que le matériau de soudure se trouve à l'état fondu et tandis que le matériau de soudure se solidifie en refroidissant.

Affiliated with

Also associated with

Rating

Process of using an active solder alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of using an active solder alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of using an active solder alloy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1424662