Process plate for plastic pin grid array and method of making

Details Process plate for plastic pin grid array and method of making Process plate for plastic pin grid array and method of making

H - Electricity

01

R

H01R 9/00 (2006.01) B23P 21/00 (2006.01) H01L 21/00 (2006.01) H01L 21/48 (2006.01) H01R 43/20 (2006.01)

Patent

CA 2064249

2064249 9102388 PCTABS00003 A process plate for the manufacture of molded electronic packages such as plastic pin grid array packages is provided. The process plate is a single fixture which is used to position terminal pins (24), align the pins (24) for electrical interconnection and form the base of the mold during encapsulation. In one embodiment, the process plate comprises a support plate (50) which is used for all standard terminal pin (24) configurations and a thin cover plate (60) which is specific for each terminal pin (24) configuration. The process plate reduces the number of fixtures required to mold an electronic package reducing both cost and assembly error.

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