Process to create metallic stand-offs on an electronic circuit

Details Process to create metallic stand-offs on an electronic circuit Process to create metallic stand-offs on an electronic circuit

H - Electricity

05

K

H05K 3/00 (2006.01) H01L 21/48 (2006.01) H01L 23/40 (2006.01) H01L 23/498 (2006.01) H05K 3/24 (2006.01) H05K 3/40 (2006.01) H05K 1/11 (2006.01) H05K 3/06 (2006.01) H05K 3/10 (2006.01) H05K 3/28 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2222857

A process to create metallic stand-offs or studs on a printed circuit board (PCB). The process allows to obtain studs constituted by three successive layers of metal (Cu1, Cu2 and Cu3 or Ni) of which at least the two first layers are made of copper. The height of the so-create stand-off is sufficient to use it in the flip chip technology to assemble chips to a printed circuit board. The present process is implemented according either to the electro-plating (galvano-plating) or to the electrochemical-plating technique.

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