Process using plasma for forming conductive through- holes...

Details Process using plasma for forming conductive through- holes... Process using plasma for forming conductive through- holes...

H - Electricity

05

K

356/16

H05K 3/46 (2006.01) H05K 3/00 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1214570

TITLE PROCESS USING PLASMA FOR FORMING CONDUCTIVE THROUGH-HOLES THROUGH A DIELECTRIC LAYER ABSTRACT A conductive through-hole is formed by plasma etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.

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