F - Mech Eng,Light,Heat,Weapons – 15 – D
Patent
F - Mech Eng,Light,Heat,Weapons
15
D
137/137
F15D 1/00 (2006.01) B01J 8/14 (2006.01) B01J 8/32 (2006.01) F27B 15/00 (2006.01)
Patent
CA 1321941
ABSTRACT PROCESSES IN WHICH MATTER IS SUBJECTED TO FLUID FLOW Apparatus is provided for subjecting matter to fluid flow. The apparatus comprises a chamber 10 having an annular fluid inlet 14 beneath a first annular region 22 in the chamber. A second annular region 24 is contiguous with and disposed outwardly of the region 22 between the region 22 and a circumferential wall 12, which has a slope 18 towards the annular inlet 14. Means shown as an annular array of radially extending slots provided in an annular wall portion (Figure 3) direct fluid through the inlet 14 with vertical and circumferential flow components. In use matter in the chamber is moved in a band continuously along an annular path in the regions 22, 24. The matter is moved vertically and circumferentially whilst in the region 22 by the flow therein, is moved out of this flow into region 24 by circumferential force and is directed back into the region 22 by the slope 18 as indicated by arrows 30. Thus the matter is not continuously subjected to the fluid flow whilst being moved in its annular path in the chamber 10.
580998
Mortimer Technology Holdings Limited
Smart & Biggar
LandOfFree
Processes in which matter is subjected to fluid flow does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Processes in which matter is subjected to fluid flow, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processes in which matter is subjected to fluid flow will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1240919