H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 1/02 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2163627
A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer (20a) for interconnecting a circuit chip (14) supported by a substrate (10) and the use as printed circuit board material (110).
Procédé de traitement d'un matériau à faible constante diélectrique consistant à disperser un matériau d'apport dans une couche poreuse à faible constante diélectrique, à fabriquer la structure électronique désirée et à enlever le matériau d'apport des pores de ladite couche. Cet enlèvement peut s'effectuer par sublimation, évaporation et diffusion. Les mises en application de la couche à faible constante diélectrique comprennent son utilisation en tant que couche de recouvrement (20a) servant à interconnecter une puce (14) supportée par un substrat (10), ainsi qu'en tant que matériau de carte à circuit imprimé (110).
Cole Herbert Stanley
Daum Wolfgang
Sitnik-Nieters Theresa Ann
Wojnarowski Robert John
Company General Electric
Craig Wilson And Company
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