Processing microchips

Details Processing microchips Processing microchips

H - Electricity

01

L

H01L 21/60 (2006.01) H01L 21/768 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2087429

2087429 9202038 PCTABS00010 Uniaxially conductive connector formed in situ on microchip by laser drilling an insulating layer at least 5 micrometres thick to provide holes communicating with the chip bonding sites, and depositing metal in the holes to establish electrical connection with the bonding sites. Excimer U.V. laser ablation of a polyimide insulating layer is preferred, followed by removal of a surface layer (preferably of amorphous polyamide) from the insulating layer to expose the ends of the metal deposited in the holes.

Affiliated with

Also associated with

Rating

Processing microchips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processing microchips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing microchips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1533862