B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 26/38 (2006.01) B23K 26/18 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2652480
A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on the workpiece, and a step of removing the sacrificial layer (5) from the workpiece after the through-hole forming step.
La présente invention concerne un procédé de traitement pour former un orifice passant dans une pièce à travailler (1) en utilisant un faisceau laser à impulsions. Le procédé comporte une étape de formation d'une couche sacrificielle détachable (la) sur la pièce à travailler (1), une étape de formation de l'orifice passant (5) dans la pièce à travailler par un faisceau laser avec la couche sacrificielle (la) formée sur la pièce à travailler, et une étape de retrait de la couche sacrificielle (5) de la pièce à travailler après l'étape de formation de l'orifice passant.
Hashida Masaki
Mishima Hidehiko
Okuda Yasuhiro
Sakabe Shuji
Shimizu Seiji
Marks & Clerk
Sumitomo Electric Industries Ltd
LandOfFree
Product having through-hole and laser processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Product having through-hole and laser processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Product having through-hole and laser processing method will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2086810