C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5479
C08L 59/00 (2006.01) C08G 2/30 (2006.01) C08G 18/00 (2006.01) C08L 59/02 (2006.01) C08L 79/00 (2006.01)
Patent
CA 1101584
PRODUCTION OF AN IMPROVED NON-REINFORCED POLYOXYMETHYLENE MOLDING COMPOSITION WHICH FORMS REDUCED MOLD DEPOSITS UPON MOLDING ABSTRACT OF THE DISCLOSURE The mold deposit problem commonly associated with non-reinforced polyoxymethylene molding compositions which creates a non-uniform surface on a molded article effectively is minimized. The polyoxymethylene polymer ini- tially is heated (as described) while in admixture with about 0.25 to about 3 percent by weight based upon the weight of the polyoxymethylene polymer of a certain polycarbodiimide. The polycarbodiimide contains at least three carbodiimide units per polycarbodiimide molecule and is derived from one or more aromatic diisocyanates which are unsubstituted or are substituted with up to one methyl substituent on each aromatic ring.
292351
Celanese Corporation
Smart & Biggar
LandOfFree
Production of an improved non-reinforced polyoxymethylene... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Production of an improved non-reinforced polyoxymethylene..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Production of an improved non-reinforced polyoxymethylene... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-755780