C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5479
C08L 59/02 (2006.01) C08G 2/30 (2006.01) C08L 69/00 (2006.01)
Patent
CA 1096088
ABSTRACT OF THE DISCLOSURE The mold deposit problem commonly associated with polyoxymethylene molding compositions which creates a non-uniform surface on a molded article effectively is minimized. The polyoxymethylene polymer initially is heated (as described) while in admixture with about 1 to about 4 percent by weight based upon the weight of the oxymethylene polymer of an aromatic polycarbonate (as defined). In a preferred embodiment a minor quantity of malonamide also is admixed with polyoxymethylene polymer and the aromatic polycarbonate during heating.
292386
Celanese Corporation
Smart & Biggar
LandOfFree
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