Production of bubble-free electrical laminates

Details Production of bubble-free electrical laminates Production of bubble-free electrical laminates

B - Operations, Transporting

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B32B 15/12 (2006.01) B29C 37/00 (2006.01) B32B 27/04 (2006.01) B32B 38/08 (2006.01) D21H 25/06 (2006.01) H05K 3/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1167364

ABSTRACT OF THE DISCLOSURE Bubble- or void-free electrical laminates such as unclad or metal clad laminates are produced by impregnating a porous fibrous substrate with a solvent-free liquid resin capable of curing to a rigid state without producing a volatile by- product, combining a plurality of impregnated substrates to form a unitary member, allowing substantially all of entrapped air bubbles retained in the combination to disappear by dissolving into the liquid resin, and then curing the combina- tion.

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