Profile characterization

Details Profile characterization Profile characterization

G - Physics

05

B

G05B 19/401 (2006.01) B23C 9/00 (2006.01) B23Q 17/20 (2006.01) B23Q 17/24 (2006.01) G05B 19/4093 (2006.01)

Patent

CA 2614310

A system and method are disclosed for quickly characterizing the profile of a surface of a workpiece using a non-contact scanner, such as a laser scanner, in preparation for subsequent machining. The method determines the location of a plurality of features of a workpiece on a machine tool, and comprises steps of reading a first list of approximate feature locations, defining a scan path based on the first list, scanning a profile of the workpiece along the scan path and calculating an actual location of each feature of said plurality of features based on the profile. The system and method are well suited to determining the location of features such as holes in welded header boxes.

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