Profiling arrangement with a profiling machine and with a...

Details Profiling arrangement with a profiling machine and with a... Profiling arrangement with a profiling machine and with a...

B - Operations, Transporting

21

C

B21C 37/083 (2006.01) B21C 37/15 (2006.01) B21D 47/01 (2006.01) B23K 26/067 (2006.01) B23K 26/20 (2006.01) B23K 31/02 (2006.01)

Patent

CA 2337412

A profiling arrangement (1) with a rollforming machine (2) including several roller-type forming tools (6) and with a welding device (3) positioned in its processing path makes possible the application of more than one weld joint to a workpiece (51, 52, 53, or 54) to be manufactured. The welding device includes a single energy source and this source is connected with at least two welding heads (9) and (10) for producing both weld joints. The energy produced by welding device (3) is divided over the individual welding heads (9 and 10). This is especially favorable in the case of a welding device (3) with a laser-beam source. The laser beam can be split into several partial laser beams and guided to the individual laser-beam welding heads.

Affiliated with

Also associated with

Rating

Profiling arrangement with a profiling machine and with a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Profiling arrangement with a profiling machine and with a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Profiling arrangement with a profiling machine and with a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1420190