Promoting adhesion between resin binder and an inorganic...

Details Promoting adhesion between resin binder and an inorganic... Promoting adhesion between resin binder and an inorganic...

C - Chemistry, Metallurgy

08

K

400/1305, 400/41

C08K 5/54 (2006.01) C08K 9/06 (2006.01) C08L 43/04 (2006.01) C08L 101/00 (2006.01) C09D 201/00 (2006.01) C09J 5/02 (2006.01) C09J 157/04 (2006.01)

Patent

CA 1142284

D-12,238 PROMOTING ADHESION BETWEEN RESIN BINDER AND AN INORGANIC OXIDE SUBSTRATE ABSTRACT OF THE DISCLOSURE Bonding between thermoplastic resins and inorganic oxide substrates is improved by providing to the resin/inorganic oxide interface as an adhesion promoter a combination of (a) a copolymer of an ethylenically unsaturated organic monomer and an unsaturated organosilane containing hydrolyzable groups; and (b) a monomeric hydrolytically reactive organosilane. S P E C I F I C A T I O N

335890

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