Protected conductive foil and procedure for protecting an...

B - Operations – Transporting – 32 – B

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154/72.06, 154/9

B32B 7/06 (2006.01) B32B 7/14 (2006.01) B32B 15/08 (2006.01) H05K 3/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2016105

ABSTRACT OF THE DISCLOSURE A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering one side of the foil with a sheet of polyethylene film. The film is removably joined with the foil by an adhesive material placed between the film and the foil in a marginal area of the latter. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.

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