Protection of devices from electrostatic discharge and...

H - Electricity – 05 – F

Patent

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Details

H05F 1/00 (2006.01) C08K 3/04 (2006.01) C08K 3/08 (2006.01) H01B 1/22 (2006.01) H01B 1/24 (2006.01) H05F 3/00 (2006.01)

Patent

CA 2045787

By using a specific polymer material for handling, shipping, and storage, integrated circuits are protected from both corrosion and electrostaticdischarge. This enclosure material includes a polymer matrix with both carbon black and a metal embedded. Suitable metals include copper, iron, cobalt, and manganese.

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