C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 83/00 (2006.01) B05D 3/06 (2006.01) C08L 83/14 (2006.01) C23C 16/30 (2006.01) C23C 16/40 (2006.01) C23C 16/517 (2006.01) H05H 1/34 (2006.01)
Patent
CA 2147486
A method of preparing a coated substrate is disclosed. The substrate is coated with a plasma generated polymer containing Si, O, C and H in specific atom ratio wherein the polymer also contains certain functional groups. A power density of 106 to 108 J/Kg is employed in die plasma polymerization process.
Hu Ing-Feng
Tou James C.
Smart & Biggar
The Dow Chemical Company
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