Protective layer for a semiconductor device

H - Electricity – 01 – L

Patent

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Details

H01L 23/29 (2006.01) H01L 23/31 (2006.01)

Patent

CA 2384784

A semiconductor device comprises at least one first semiconductor layer (1-4) and a second layer (8) applied on at least a surface portion of the first layer for protecting the device. The protecting layer is of a second material having a larger energy gap between the valence band and the conduction band than a first material forming said first layer. The second material has at least in one portion of said protecting layer a nano-crystalline and amorphous structure by being composed of crystalline grains with a size less than 100 nm and a resistivity at room temperature exceeding 1x1010 .OMEGA.cm.

Un dispositif à semi-conducteur comprend au moins une première couche à semi-conducteur (1-4) ainsi qu'une seconde couche (8) appliquée sur au moins une partie de surface de la première couche afin de protéger le dispositif. La couche de protection se compose d'un second matériau ayant une largeur de bande interdite plus grande entre la bande de valence et la bande de conduction qu'un premier matériau constituant ladite première couche. Le second matériau présente au moins, dans une partie de ladite couche de protection, une structure nanocristalline et amorphe du fait qu'il est constitué de grains cristallins ayant une grosseur inférieure à 100 nm et une résistivité à température ambiante dépassant 1x10?10¿.OMEGA.cm.

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