Ptc element and method of manufacturing the same

Details Ptc element and method of manufacturing the same Ptc element and method of manufacturing the same

H - Electricity

01

C

H01C 7/02 (2006.01) H01C 1/142 (2006.01) H01C 7/04 (2006.01) H01C 17/065 (2006.01) H05B 3/14 (2006.01)

Patent

CA 2344532

Conductors (13) are buried by pressing in a composition formed body (12) prepared by kneading 35-60 vol% of a conductive powdery filler with a crystalline polymer component in such a way that the conductors (13) are partly exposed from the surface of the composition formed body. Plating electrodes (14A, 14B) are formed by plating on the composition formed body (12). The conductive powdery filler contains at least one kind of TiC, WC, W2C, ZrC, VC, NbC, TaC, and Mo2C. The adhesion between the PTC composition and the electrodes are good, and the contact resistance between them are low. Such a PTC device is excellent in stability against repeated current application.

L'invention porte sur des conducteurs (13) qui sont enfouis en exerçant une pression dans un corps (12) constitué d'une composition et préparé par pétrissage de 35 à 60 % en volume d'une charge en poudre conductrice avec un composant polymère cristallin de sorte que les conducteurs (13) soient partiellement dégagés de la surface du corps constitué de la composition. Des électrodes de platine (14A, 14B) sont formées par placage sur le corps (12) constitué de la composition. La charge conductrice en poudre contient au moins un type de TiC, WC, W¿2?C, ZrC, VC, NbC, TaC et Mo¿2?C. L'adhésion entre la composition à coefficient de température positif et les électrodes est bonne, et la résistance au contact entre elles, faible. Ce dispositif à coefficient de température positif présente une excellente stabilité contre les applications répétées de courant.

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