Pulverulent compounds, a process for their preparation, and...

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 18/80 (2006.01) C08G 18/58 (2006.01) C08G 59/40 (2006.01) C09J 5/06 (2006.01) C09J 175/04 (2006.01)

Patent

CA 2210043

Disclosed is a composition containing a 1,2-epoxide compound having more than one 1,2-epoxide group and one or more hydroxyl groups and, as a curing agent, a polyisocyanate blocked with an inert blocking agent and a cyclic amidine of the formula: (SEE FIG. I) or (SEE FIG. II) (wherein R1 through R12 are each hydrogen or alkyl, cycloalkyl, aralkyl or aryl radicals), in which, an OH:NCO ratio is from 1:0.1 to 1:1, the content of the cyclic amidine is from 2 to 9% by weight based on the epoxy compound and the curing agent contains from 0.9 to 0.3 mol of the inert blocking agent and from 0.1 to 0.6 mol of the cyclic amidine per NCO group. The composition is useful as adhesive and forms thermally stable and solvent-resistant bond.

On divulgue une composition contenant un composé 1,2-époxyde portant plus d'un groupe 1,2-époxyde et un ou plusieurs groupes hydroxyle et, comme agent de durcissement, un polyisocyanate bloqué avec un agent bloquant inerte et une amidine cyclique de formule : (Voir FIG. I) ou (Voir FIG. II) (où R1 à R12 sont chacun un atome d'hydrogène ou des radicaux alkyle, cycloalkyle, aralkyle ou aryle), où le rapport OH:NCO varie de 1:0,1 à 1:1; la teneur en amidine cyclique varie de 2 à 9 % en poids, par rapport au poids du composé époxy et l'agent de durcissement contient de 0,9 à 0,3 mole de l'agent bloquant inerte et de 0,1 à 0,6 mole de l'amidine cyclique par groupe NCO. La composition est utile comme adhésif et forme une liaison thermostable et résistante à des solvants.

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