C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 163/00 (2006.01) C09J 11/00 (2006.01)
Patent
CA 2665551
This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are capable of being easily pumped under high shear at temperatures around room temperature but are resistant to being washed off substrate surfaces prior to being cured.
L'invention concerne des compositions utiles en tant qu'adhésifs, et plus particulièrement la préparation de compositions adhésives à base d'époxy thermodurcissables pouvant être pompées facilement sous un cisaillement élevé et à des températures proches de la température ambiante, mais résistant à un lavage de surface de substrat avant d'être durcies.
Agarwal Rajat
Hartsell Scott
Lammerschop Olaf
Henkel Ag & Co. Kgaa
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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