F - Mech Eng,Light,Heat,Weapons – 25 – D
Patent
F - Mech Eng,Light,Heat,Weapons
25
D
F25D 17/02 (2006.01) F25B 23/00 (2006.01) F28D 15/02 (2006.01) H01L 23/427 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2342570
An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.
Système de refroidissement amélioré placé à distance des composants électriques et électroniques, dont la consommation de courant parasitique est très faible et dont le coefficient de transfert de chaleur est très élevé. Les composants à refroidir sont en contact thermique avec une plaque froide d'évaporation. Une pompe fait circuler un liquide frigorigène vers la plaque froide d'évaporation et le liquide frigorigène s'évapore au moins partiellement sous l'effet de la chaleur produite par le composant. Un serpentin réfrigérant classique condense la vapeur, puis le liquide condensé et le liquide non évaporé retournent à la pompe. Le système est presque isotherme à l'évaporation et à la condensation.
Marks & Clerk
Thermal Form & Function Inc.
Thermal Form & Function Llc
LandOfFree
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