C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/60 (2006.01)
Patent
CA 2716115
An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it further contains (ii) N-methyl pyrrolidone is described.
Linvention concerne un bain délectrolyte aqueux sans cyanure pour le plaquage de couches en alliage détain sur des surfaces de substrats. Le bain selon linvention comprend (i) une source dions étain et une source dun autre élément dalliage. Le bain selon linvention est caractérisé en ce quil contient également (ii) de la N-méthylpyrrolidone.
Brunner Heiko
Hartmann Philip
Kohlmann Lars
Schulz Klaus-Dieter
Atotech Deutschland Gmbh
Teitelbaum & Maclean
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