Pyrophosphate-containing bath for cyanide-free deposition of...

Details Pyrophosphate-containing bath for cyanide-free deposition of... Pyrophosphate-containing bath for cyanide-free deposition of...

C - Chemistry, Metallurgy

25

D

C25D 3/60 (2006.01) C25D 3/02 (2006.01)

Patent

CA 2724211

A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.

L'invention concerne un bain contenant des pyrophosphates pour le dépôt sans cyanure d'alliages de cuivre sur des surfaces de substrats, comprenant un produit de réaction d'une monoamine secondaire avec un oxyde de diglycidyle. Le bain électrolytique est approprié pour le dépôt galvanique de revêtements d'alliage de cuivre-étain égaux et uniformes de couleur blanche brillante.

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