Radial cell electroplating device

C - Chemistry – Metallurgy – 25 – D

Patent

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C25D 17/00 (2006.01) C25D 5/08 (2006.01) C25D 7/06 (2006.01)

Patent

CA 1309060

ABSTRACT OF THE DISCLOSURE: Radial cell electroplating device, especially suitable for high current density electrodeposition of metals and metal alloys, wherein the arrangement of the means for feeding the electrolyte to the cell and for discharging it therefrom permits instantaneous regulation of electrolyte flow direction and velocity parameters simply by adjusting valves thereby adapting conditions and hence optimizing the movement conditions of the strip to be plated, at the current density used and the prevailing electrolyte aeration conditions, so as to optimize the quality of the product obtained.

515330

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