C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
96/155, 402/406,
C08F 20/20 (2006.01) C08F 20/34 (2006.01) C08K 5/16 (2006.01) C08K 5/17 (2006.01) C09D 11/10 (2006.01)
Patent
CA 1050696
ABSTRACT OF THE DISCLOSURE A radiation curable composition is disclosed containing (1) from about 5 to 80% by weight of the compound of the formula: Image wherein A is hydrogen or methyl; R is a radical of the formula -CH2CH2X wherein X is hydroxy or nitro; m is a number having a value in the range of 1 to 2; and n is a number having a value in the range of 0 to 1, (2) from about 20 to about 95% of another photo-polymerizable polyfunctional ethylenically unsaturated compound and (3) an effective amount of a photoinitiator. These compounds are particularly suitable as adhesives in the laminating art such as coatings for metals, plastics, textiles, etc., as well as being suitable for vehicles of printing inks.
214717
Graham Sandra I.
Nyi Kayson
LandOfFree
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