C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5156, 400/55
C08L 33/14 (2006.01) C08F 299/06 (2006.01) C08G 18/67 (2006.01) C08J 3/28 (2006.01) C08L 75/04 (2006.01) C09D 4/00 (2006.01)
Patent
CA 1102039
Abstract The addition of minor amounts of acrylic acid to radiation curable compositions containing unsaturated addition-poly- merizable urethane resin and reactive monomer diluent is effective in reducing viscosity and thixotropy of the com- positions and in inhibiting separation of the resin phase from the diluent phase. In addition, acrylic acid has been found to render unsaturated addition-polymerizable urethane resins more compatible with higher molecular weight reactive monomer diluents.
283373
Howard Dennis D.
Martin Brian
Lord Corporation
Marks & Clerk
LandOfFree
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