Radiation curable compositions

G - Physics – 03 – F

Patent

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Details

G03F 7/038 (2006.01) C08F 8/00 (2006.01) G03F 7/027 (2006.01) G03F 7/033 (2006.01)

Patent

CA 2429173

A photo-resist composition is disclosed that is a partial esterification product of a styrene maleic anhydride copolymer with (meth)acrylate and hydroxyl containing side chains. An amide containing (meth)acrylate is optionally present. These compositions exhibit a good balance between UV cure rate, tack free properties, and dissolution of uncured composition by dilute alkaline solution.

L'invention concerne une composition de photorésist constituant un produit d'estérification partielle d'un copolymère à base d'anhydre maléique styrène avec du (méth)acrylate et de l'hydroxyle contenant des chaînes latérales. Un amide contenant du (méth)acrylate est éventuellement présent. Ces compositions présentent un bon équilibre entre vitesse de durcissement par UV, propriétés hors poisse, et dissolution de composition non durcie par une solution alcaline diluée.

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